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Dear reader,

Thank you very much for your interest in the latest news of the Smart Anything Everywhere Initiative. You are very welcome to distribute our newsletter. To subscribe to our news service please send a short email to

Enjoy reading!

Best regards from the team of the Smart Anything Everywhere Initiative
Stephan Karmann & Julia Koch
Hahn-Schickard, Villingen-Schwenningen, Germany


May 14 2019: Digital Innovation Hubs Day, Stuttgart (Germany)

Digital Innovation Hubs (DIHs) are one of the key elements of the Digitising European Industry Strategy (DEI) strategy of the European Commission with the aim to support companies – notably SMEs, start-ups and mid-caps – to become more competitive through the adoption of latest digital technologies. Every company in Europe should have a DIH at a working distance, and the aim is to have at least one in every region in Europe. DIHs will bring user companies (with a need to invest in digital technologies) in contact with supply companies that have suitable ICT products that address the needs of the users. The DIHs act as a one-stop-shop, offering access to digital technologies and competences, infrastructure to test digital innovations, training to develop digital skills, financing advice, market intelligence as well as networking opportunities.

The Digital Innovation Hubs Day will bring together European digitisation initiatives and Digital Innovation Hubs (DIH) with the ones situated in Baden-Wuerttemberg (south-western Germany) and its neighbouring countries Austria, Switzerland and France. Participants will learn about the different concepts of the DIHs and initiatives, share their experiences and can explore possible collaborations. A special focus will be on interactive discussion sessions addressing questions such as:

  • How to support many small projects
  • Cascade Funding – an instrument fitting the needs of SMEs
  • Experiences and lessons learnt (by DIHs and SMEs)
  • Re-use of technological building blocks in new projects
  • How to create a leverage effect of public funding
  • Collaboration of initiatives and hubs on regional, national and EU levels

Join this event chaired by Dr. Max Lemke from the European Commission and get in contact with key-players from Regions, Regional Clusters, Research and Technology Organisations (RTOs) and industry/ SMEs to exchange views on existing and future DIHs.

Participation is free of charge. Please register here.

DIHNET.EU was launched

Digital Innovation Hubs (DIHs) from any regions of the European Union can engage now on the DIHNET community platform. It was launched beginning of April 2019: WWW.DIHNET.EU.

The web-based offer enables the cooperation and coordination of European, national and regional initiatives, creates a sustainable pan-European network with a focus on regional DIHs and directly supports the digital transformation in Europe.

TETRAMAX scholarship for the 15th International Summer School on Advanced Computer Architecture and Compilation for High-Performance and Embedded Systems, 14-20 July 2019 in Fiuggi, Italy

The ACACES Summer School is organized by the HiPEAC Network of Excellence in collaboration with the TETRAMAX Innovation Action and Eurolab4HPC. The ACACES Summer School is a one week summer school for computer architects and tool builders working in the field of high performance computer architecture and compilation for computing systems. The school aims at the dissemination of advanced scientific knowledge and the promotion of international contacts among scientists from academia and industry.

The grant covers the registration fee of 1.000 EUR, which includes Hotel for 6 nights, tuition and course notes, all meals as well as transportation from the airport. For further information and application form click here.

Open & Upcoming CALLS

Currently, several projects aligned to the SAE initiative offer possibilities to engage within their open calls:

SmartEES Open Call for Flexible Electronics (apply until April 19th 2019.

The application experiments aim at providing support to Innovative Companies to access new markets and grow their businesses by integrating flexible electronics technologies into advanced products and services. Find the complete call text and further information here.

TETRAMAX Open Calls for

  • Entrepreneurial
  • Bilateral as well as
  • Value chain oriented interdisciplinary Technology Transfer Experiments (TTX)

Calls are expected to open in August, September and October 2019 year. Find further information here.


Results for 3rd FED4SAE Open Call

FED4SAE 3rd call was closed on March 5th, 44 proposals were received. Submitted proposals came from 19 different countries, 17 are European countries – 16 EU members – and 3 associated countries. The proposals are covering all the competence & advanced technologies, testbeds and industrial platforms offered by FED4SAE. It is planned to select 15 proposals among those 44, the evaluation committee meeting is hosted by UNICAN (Santander, Spain) in April. The notifications will be send out to every participant on April 25th.

Results for TETRAMAX first Entrepreneurial Technology Transfer Experiments (TTX) open call

Four experiments out of 21 submitted proposals were selected for financial support: MIP, REMAP, TooFF.IN and UnifiedAOTool. By focusing on the exploration and evaluation of market and business opportunities in the customized low-energy computing domain, small teams will work towards a sustainable start-up business scenario and necessary investment acquisitions. Find further information here.

5 Bilateral Technology Transfer Experiments selected for financial support

All 26 experiment proposals submitted to this TETRAMAX call were subject to an in-depth evaluation, conducted by external experts. The assessment based on defined criteria resulting in a score and individual comments on technical aspects described in the proposal. Following this assessment, five experiments and recipients selected for financial support within its 2nd open call for Bilateral Technology Transfer Experiments (TTX). For further information please check online the evaluation public summary report here

Preliminary results for DIATOMIC Open Call #2

A total of 175 applications have been submitted for DIATOMIC Open Call #2, which was almost double the amount than in the first Call. It is expected that 9 application experiments (26 partners from 10 European countries) will enter an intensive, milestone-driven acceleration programme, designed around 3-stages, each of which is a step closer to market entry: ’Design’, ’Develop’, ’Market’. Each application experiment falls into one of the following domains: health, agrifood, manufacturing. Apart from the financial support (up to EUR200k per application experiment), some of the high-level benefits include access to advanced technological tools and testbeds, as well as mentoring/ networking services to speed up time-to-market of novel products and services based on advanced microelectronics technologies and smart systems integration.


Meet us at the following events:

16-17 April 2019: ARTEMIS Technology Conference, Schipol (The Netherlands)

The digital transformation brings with it both new opportunities and challenges. Production equipment itself will become intelligent, so what kind of innovation in embedded intelligent systems is needed to unlock its full potential for Europe’s society in the future? The development of smart cars can help them to stay mobile and lead lives that are more active. This is just a grasp of the technology challenges Europe’s society will face. For further information and registration, please click here.

May 14 2019: Digital Innovation Hubs Day, Stuttgart (Germany

Join this event chaired by Dr. Max Lemke from the European Commission and get in contact with key-players from Regions, Regional Clusters, Research and Technology Organisations (RTOs) and industry/ SMEs to exchange views on existing and future DIHs.

Participation is free of charge. Please register here

May 21-23 2019: Automotive Interiors Expo 2019, Stuttgart (Germany)

Meet the SmartEEs team at their booth and hear the colleagues from Fraunhofer FEP talk about flexible electronics and your possibilities with the SmartEEs Program. The SmartEES team will be very happy to meet you and guide you through the new business opportunities provided by flexible electronics. For further information click here.


LOPEC, Munich (Germany)

New attendance record has shown that LOPEC really is the leading trade fair and the most important conference for the printed electronics industry. Rainer Günzler from Hahn-Schickard was invited to speak about the Smart Anything Everywhere Initiative and give information at SmartEES booth. For the second year in a row, SmartEEs, InSCOPE and Lyteus, the three H2020 funded projects dealing with flexible electronics technologies, were jointly exhibiting demonstrators and talking about the said technologies and their applications.

DATE 2019, Firenze (Italy)

SAE aligned Innovation Action TETRAMAX organized a workshop on ‘Smart funding for digitization of Europe’s Industry’ at the DATE 2019 conference. A few of TETRAMAX’ technology transfer experiments such as EverMore, Carrots and TetraWin presented the results of their technology experiment to a full exhibition room. The workshop organised by Luca Fanucci and Bernd Janson on March 27 showed the impact of the international cooperations between researchers and SMEs supported by TETRAMAX. It inspired the audience to engage in international technology transfer.

You can find the highlights of the workshop by clicking here.

At the same time, TETRAMAX and EEN organized a matchmaking event, offering participants the possibility to pitch their project or technology and afterwards have a one on one meeting with other relevant participants. About 30 people registered for the matchmaking event and exchanged information. Events such as these can really boost the brokerage portal and consequently foster transfer from research to business. If you have a technology offer or a technology request, do not hesitate to have a look at the brokerage portal or add it to it. The TETRAMAX Chief Technology Broker or your regional or national contact point will help along as first-hand “shopping places”.

Want to know more?


Numerous interesting applications experiments have been funded through Innovation Actions aligned to the Smart Anything Everywhere Initiate. Check out the latest videos and success stories online at Success Stories or videos.


Do you know how to profit even more from the Smart Anything Everywhere Initiative?

By becoming a member and joining our community you will benefit free of charge from our contacts with suppliers and users of innovative digital technologies get help on the path towards digital transformation and find a Digital Innovation Hub (DIH) in your region to support you brokerage facilities to look for or launch new proposals or projects investment opportunities in different digital technology areas networking possibilities with other members and exchanging information on the latest digital innovations. Join our community today under

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Your team of the Smart Anything Everywhere initiative
Julia Koch & Stephan Karmann (Hahn-Schickard, Germany)